1～2 件を表示 ／ 全 2 件
This is an introduction to examples of through-hole processing for LCP (liquid crystal polymer).
A through hole with a diameter of 0.15 mm was processed in LCP (liquid crystal polymer) with a thickness of 0.05 mm. Compared to conventional laser processing, we achieved fine processing with less thermal impact.
Improving the quality of smartphone components with 10μm precision machining.
In the smartphone component industry, miniaturization and high functionality are advancing, making the processing of precision metal parts essential. Particularly for components that require high precision within limited space, micro-machining technology significantly influences product performance. The LTC6050 achieves high-level micro-machining with a minimum beam diameter of Φ10μm, contributing to the improvement of smartphone component quality. 【Application Scenarios】 * Precision part processing inside smartphones * Processing of small connectors, shield cases, etc. * Manufacturing of parts that achieve thinness and lightweight 【Effects of Implementation】 * Improvement in product quality through high-precision part processing * Increased yield * Enhanced design flexibility
